日本BONKOTE松香助焊筆BON-102

松香筆，邦可松香筆，助焊筆 

特點:

1.操作性優(yōu)，易攜帶。

2.助焊劑可以重復補充

3.助焊劑停止蒸發(fā)，保持比重穩(wěn)定

4.恰當?shù)暮噶髡{(diào)整機構防止焊錫滴落

5.充滿酒精可以用作清洗刷。

6.筆體透明，余量一目了然

型號:BON-102 / 102D / 102L / 102B / FALPHA205 / 615, 各種焊接時用。 

用途： 

1.焊接前，在母材上涂抹助焊劑（提高浸潤性） 

通過向修正時的對象物涂抹助焊劑，可除去氧化臘并提高浸潤性。 

3.可用酒精等溶劑清洗基板（禁止使用有機溶劑）

· ============松香助焊筆CW82009g(0.32oz)===========

松香助焊筆CW82009g(0.32oz)

■無腐蝕、不導電的R型助焊劑

■助焊劑符合MIL-F-14256F之R型和ANSI/IPCJ-STD-004,POL0型

線路板用松香助焊劑筆

CircuitWorks助焊筆專門設計用于精*確控制每種類型的助焊劑。松香焊劑筆快速應用非腐蝕性R型焊劑。該焊劑符合MIL-F-14256 E和F。

特點和優(yōu)點

鑿尖標記提供了準確的焊劑輸送到表面

施加非腐蝕性、非導電性R型焊劑

焊劑符合MIL-F-14256 F R型和ANSI/IPC J-STD-004 ROL0型

使用助熔劑去除筆輕松去除松香或CircuitWorks松香助熔劑

符合RoHS

CircuitWorks Rosin Flux Pen

CircuitWorks Flux Pens are designed specifically to apply each type of flux with precision control. The Rosin Flux Pen quickly applies a noncorrosive type R flux. This flux meets MIL-F-14256 E and F.

FEATURES & BENEFITS

· Chisel tip marker provides exact delivery of flux to surface

· Applies a noncorrosive, nonconductive Type R flux

· Flux meets MIL-F-14256 F Type R and ANSI/IPC J-STD-004, Type ROL0

· Easily removed with Flux-Off® Rosin or CircuitWorks® Rosin Flux Remover Pen

· RoHS compliant

186 Flux Pen®專為傳統(tǒng)和表面貼裝電路板組件的含鉛和無鉛返工而設計。

186根據(jù)MIL-F-14256，被QPL批準為RMA型。雖然助熔劑的能力接近于RA型焊劑，但釬焊后的殘留物無腐蝕性和不導電性。

186已開發(fā)用于焊接困難組件的關鍵應用，但工藝要求規(guī)定使用RMA型焊劑。

186具有較高的熱穩(wěn)定性，用于焊接需要較高溫度的多層組件。暴露在高溫下不會降低殘渣在正常清洗溶劑中的溶解度。焊劑殘留物不會導致表面絕緣電阻退化。使用最少的離子活化劑和殘余物的非活性性質(zhì)允許殘余物留在電路板組件上用于許多應用。助焊劑殘留物還具有防潮和抗真菌性。

 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies.

186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive.

186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.

186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.

產(chǎn)品簡介